Part Number Hot Search : 
D1212 W50N06 MAX99 PMV30UN MXP4002 14010 16ER1 2SC30
Product Description
Full Text Search
 

To Download CXD1196 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 CXD1196AR
CD-ROM DECODER For the availability of this product, please contact the sales office.
Description The CXD1196AR is a CD-ROM decoder LSI with a built-in ADPCM decoder. Features * CD-ROM, CD-I and CD-ROM XA format compatible * Real time error correction * Double speed playback compatible (when VDD=5.010 %) * Can be connected to a standard SRAM up to 32 Kbytes (256 Kbits). * All audio output sampling frequency : 132.3 kHz (Built-in oversampling filter) * Built-in de-emphasis digital filter * Capable of VDD 3.5 V operation Applications CD-ROM drive Structure Silicon gate CMOS IC 80 pin LQFP (Plastic)
Absolute Maximum Ratings (Ta=25 C) * Supply voltage VDD VSS -0.5 to +7.0 V * Input voltage VI VSS -0.5 to VDD +0.5 V * Output voltage VO VSS -0.5 to VDD +0.5 V * Operating temperature Topr -20 to +75 C * Storage temperature Tstg -55 to +150 C Recommended Operating Conditions * Supply voltage VDD +3.5 to +5.5 (+5.0 Typ.) V * Operating temperature Topr -20 to +75 C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
--1--
E92128B78-TE
CXD1196AR
Block Diagram
MAO-MA14 5-11.13-20
XMOE XMWR MDBO-MDB7 3 4 24-31 69 DMA FIFO DO-D7 78 64 XRD CPU I/F 65 XWR 66 XCS PRIORITY RESOLVER 68 AO 67 INT 44 INTP DMA SEQUENCER
ADDRESS GEN
C2PO 34 BCLK DATA LRCK 36 37 38 GALOIS FIELD SYNDROME GEN ECC CORRECTOR ADPCM DECODER DESCRAMBLER COP I/F SYNC CONTROL CPU DMA
51 DRO 53 XDAC
45 WCKO DAC I/F DIGITAL FILTER 46 LRCO 47 DATO 48 BCKO 50 MUTE
XRST
59
CLOCK GEN
55
54
57
2.12.23.32.42.52.63.72 GND
33.73 VDD
35 EMP
XTL1 XTL2 CLK
--2--
CXD1196AR
Pin Description No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Symbol TD7 GND XMOE XMWR MA0 MA1 MA2 MA3 MA4 MA5 MA6 GND MA7 MA8 MA9 MA10 MA11 MA12 MA13 MA14 TD6 TD5 GND MDB0 MDB1 MDB2 MDB3 MDB4 MDB5 MDB6 MDB7 GND VDD C2PO EMP BCLK DATA LRCK TD4 TD3 I/O I/O -- O O O O O O O O O -- O O O O O O O O I/O I/O -- I/O I/O I/O I/O I/O I/O I/O I/O -- -- I I I I I I/O I/O Description Test pin Ground pin Buffer memory output enable negative logic signal Buffer memory write enable negative logic signal Buffer memory address (LSB) Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address Ground pin Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address Buffer memory address (MSB) Test pin Test pin Ground pin Buffer memory data bus (LSB) Buffer memory data bus Buffer memory data bus Buffer memory data bus Buffer memory data bus Buffer memory data bus Buffer memory data bus Buffer memory data bus (MSB) Ground pin Power supply pin C2 pointer positive logic signal from CD player Emphasis positive logic signal from CD player Bit clock signal from CD player Data signal from CD player LR clock signal from CD player Test pin Test pin
--3--
CXD1196AR
No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
Symbol TD2 GND TD1 INTP WCKO LRCO DATO BCKO N. C MUTE DRQ GND XDAC XTL2 XTL1 TD0 CLK TDIO XRST TA3 TA2 TA1 GND XRD XWR XCS INT A0 D7 D6 D5 GND VDD D4 D3 D2 D1 D0 TA0 N. C
I/O I/O -- I/O I O O O O -- O O -- I O I I/O O I I I I I -- I I I O I I I I -- -- I I I I I I --
Description Test pin Ground pin Test pin INT pin polarity control signal Word clock signal to DA converter LR clock signal to DA converter Data signal to DA converter Bit clock signal to DA converter Mute positive logic signal DMA request positive logic signal Ground pin Acknowledge negative logic signal for DRQ Crystal oscillator circuit output pin Crystal oscillator circuit input pin Test pin Clock with 1/2 frequency of XTL1 Test pin Chip reset negative logic signal Test pin Test pin Test pin Ground pin CPU register read strobe negative logic signal CPU register write strobe negative logic signal Chip select negative logic signal from CPU Interrupt request signal to CPU CPU address signal CPU data bus (MSB) CPU data bus CPU data bus Ground pin Power supply pin CPU data bus CPU data bus CPU data bus CPU data bus CPU data bus (LSB) Test pin
--4--
CXD1196AR
Electrical Characteristics DC characteristics Item TTL input level pin (1) input voltage H level TTL input level pin (1) input voltage L level CMOS input level pin (2) input voltage H level CMOS input level pin (2) input voltage L level TTL schmitt input level pin (3) input voltage H level TTL schmitt input level pin (3) input voltage L level TTL schmitt input level pin (3) input voltage hysteresis CMOS schmitt input level pin (4) input voltage H level CMOS schmitt input level pin (4) input voltage L level CMOS schmitt input level pin (4) input voltage hysteresis Pull-up resistor provided input pin (5) input current Pull-down resistor provided input pin (6) input current Pull-up resistor provided bidirectional pin (7) input current Output voltage H level (8) Output voltage L level (8) Input leak current (9) Oscillation cell (10) input voltage H level Oscillation cell input voltage L level Oscillation cell logic threshold value Oscillation cell feedback resistance value Oscillation cell output voltage H level Oscillation cell output voltage L level Symbol VIH1 VIL1 VIH2 VIL2 VIH3 VIL3 VIH3 -VIL3 VIH4 VIL4 VIH4 -VIL4 IIL1 IIL2 IIL3 VOH1 VOL1 IIL2 VIH4 VIL4 LVTH RFB VOH2 VOL2 VIN=VSS or VDD IOH=-3 mA IOL=3 mA 500 K 0.5 VDD 0.5 VDD VIN=0 V VIN=0 V VIN=0 V VOH=-2 mA IOL=4 mA -40 40 -90 VDD-0.8 -40 0.7 VDD 0.3 VDD 0.5 VDD 1M 2M 0.4 40 0.6 -100 100 -200 -240 240 -440 0.8 VDD 0.2 VDD 0.4 2.2 0.8 0.7 VDD 0.3 VDD (VDD=5 V10 %, VSS=0 V, Topr=-20 to 75 C) Conditions Min. 2.2 0.8 Typ. Max. Unit V V V V V V V V V V A A A V V A V V V V V
--5--
CXD1196AR
DC characteristics Item TTL input level pin (1) input voltage H level TTL input level pin (1) input voltage L level CMOS input level pin (2) input voltage H level CMOS input level pin (2) input voltage L level TTL schmitt input level pin (3) input voltage H level TTL schmitt input level pin (3) input voltage L level TTL schmitt input level pin (3) input voltage hysteresis CMOS schmitt input level pin (4) input voltage H level CMOS schmitt input level pin (4) input voltage L level CMOS schmitt input level pin (4) input voltage hysteresis Pull-up resistor provided input pin (5) input current Pull-down resistor provided input pin (6) input current Pull-up resistor provided bidirectional pin (7) input current Output voltage H level (8) Output voltage L level (8) Input leak current (9) Oscillation cell (10) input voltage H level Oscillation cell input voltage L level Oscillation cell threshold value Oscillation cell feedback resistance value Oscillation cell output voltage H level Oscillation cell output voltage L level Symbol VIH1 VIL1 VIH2 VIL2 VIH3 VIL3 VIH3 -VIL3 VIH4 VIL4 VIH4 -VIL4 IIL1 IIL2 IIL3 VOH1 VOL1 IIL2 VIH4 VIL4 LVTH RFB VOH2 VOL2 VIN=VSS or VDD IOH=-1.3 mA IOL=1.3 mA VIN=0 V VIN=0 V VIN=0 V VOH=-1.6 mA IOL=3.2 mA Conditions
(VDD=3.5 V, VSS=0 V, Topr=-20 to 75 C) Min. 2.2 0.6 0.7 VDD 0.3 VDD 2.2 0.6 0.3 0.8 VDD 0.2 VDD 0.5 -10 10 -20 VDD-0.8 -40 0.7 VDD 0.3 VDD 0.5 VDD 1.2 K 0.5 VDD 0.5 VDD 2.5 M 5M 0.4 40 -25 25 -50 -60 60 -110 Typ. Max. Unit V V V V V V V V V V A A A V V A V V V V V
--6--
CXD1196AR
1. 2. 3. 4. 5. 6. 7. 8. 9. 10.
D7 to 0, MDB7 to 0, TD7 to 0 DATA, LRCK, C2PO, EMP, INTP, TDIO, TA3 to 0 XWR, XRD, XCS, A0, XDAC BCLK, XRST XDAC, TA3 to 0 C2PO, INTP D7 to 0, MDB7 to 0, TD7 to 0 All output pins except XTL2 All input pins except 7 input : XTL1, output : XTL2
Input/Output Capacitance Item Input pin Output pin Input/Output pin Symbol CIN COUT COUT Min. Typ.
(VDD=VI=0 V, f=1 MHz) Max. 9 11 11 Unit pF pF pF
--7--
CXD1196AR
AC Characteristics (VDD=5 V10 %, VSS=0 V, Topr=-20 to 75 C, Output load=50 pF) The values in parentheses in the table are those obtained when VDD=3.5 V, VSS=0 V, Topr=-20 to 75 C, and output load=50 pF. Values without parentheses are common to VDD=5 V10 % and 3.5 V. 1. CPU interface (1) Read
AO Thar XCS Trrl XRD
D7-D0
Tsar
Tdrd Tfrd
Item Address setting time (with respect to XCS & XRD ) Address holding time (with respect to XCS & XRD ) Data delay time (with respect to XCS & XRD ) Data float time (with respect to XCS & XRD ) L level XRD pulse width
Symbol Tsar Thar Tdrd Tfrd Trr1
Min. 30 (70) 20 (50) 0 150 (250)
Typ.
Max.
120 (200) 20 (40)
Unit ns ns ns ns ns
(2) Write
AO
XCS Twwl XWR Thaw
D7-D0 Tsdw Tsaw Thdw
Item Address setting time (with respect to XCS & XWR ) Address holding time (with respect to XCS & XWR ) Data setting time (with respect to XCS & XWR ) Data holding time (with respect to XCS & XWR ) L level XWR pulse width
Symbol Tsaw Thaw Tsdw Thwd Twwl
Min. 30 (70) 20 (50) 50 (70) 20 (30) 70 (100)
Typ.
Max.
Unit ns ns ns ns ns
--8--
CXD1196AR
(3) DMA
DRQ Tdar2
Tdar1 XDAC Trrl XRD Tsac D7-D0 Thac
Tdrd Tfrd
Item DRQ fall time (with respect to XDAC ) DRQ rise time (with respect to XDAC ) XDAC setting time (with respect to XRD ) XDAC holding time (with respect to XRD ) Data delay time (with respect to XRD ) Data float time (with respect to XRD ) L level XRD pulse width
Symbol Tdar1 Tdar2 Tsac Thac Tdrd Tfrd Trrl
Min.
Typ.
Max. 50 (120) 50 (120)
10 (30) 10 (30) 0 150 (250) 120 (200) 20 (40)
Unit ns ns ns ns ns ns ns
--9--
CXD1196AR
2. SRAM interface (1) Read
MA14-MA0 Tsao XMOE Toel Thao
MDB7-MDB0
Tsdo
Thdo
Item Address setting time (with respect to XMOE ) Address holding time (with respect to XMOE ) Data setting time (with respect to XMOE ) Data holding time (with respect to XMOE ) L level XMOE pulse width
Symbol Tsao Thao Tsdo Thdo Toel
Min. T1-30 T1-10 50 (100) 10 (20)
Typ.
Max.
2 * T1
Unit ns ns ns ns ns
(2) Write
MA14-MA0 Tsamw XMWR Tmwl Thamw
MDB7-MDB0 Tdmw Tfmw
Item Address setting time (with respect to XMWR ) Address holding time (with respect to XMWR ) Data delay time (with respect to XMWR ) Data float time (with respect to XMWR ) L level XMWR pulse width
Symbol Tsamw Thamw Tdmw Tfmw Tmwl
Min. T1-30 T1-10 10
Typ.
Max.
0 2 * T1
Unit ns ns ns ns ns
59 ns : XSLOW = `H' 238 ns : XSLOW = `L' Note that XSLOW is bit 7 of DRVIF register. When XSLOW = `H' , make sure that the CXD1196AR is connected to an SRAM with an access time of less than 120 ns. When XSLOW = `L' , make sure that the CXD1196AR is connected to an SRAM with an access time of less than 320 ns. T1= --10--
{
CXD1196AR
3. DSP Interface for CD
BCKRED= "H" Tbck BCLK Tbck
DATA Tsb1 LRCK C2PO Thb2 Tsb2 Thb1
BCKRED= "L" Tbck BCLK Tbck
DATA Tsb1 LRCK C2PO Thb2 Thb2 Thb1
Item BCLK frequency BCLK pulse width Data setting time (with respect to BCLK) Data holding time (with respect to BCLK) LRCK, C2PO setting time (with respect to BCLK) LRCK, C2PO holding time (with respect to BCLK)
Symbol Fbck Tbck Tsb1 Thb1 Tsb2 Thb2
Min. 85 50 50 50 50
Typ.
Max. 5.7
Unit MHz ns ns ns ns ns
--11--
CXD1196AR
4. DAC interface
Tbco
Tbco
BCKO
DATO Tsbo WCKO LRCO Thbc Tsbo Thbo
Item BCKO frequency BCKO pulse width DATO, WCKO, LRCO setting time (with respect to BCKO ) DATO, WCKO, LRCO holding time (with respect to BCKO )
Symbol Fbco Tbco Tsbo Thbo
Min. 50 30 30
Typ. 8.4672
Max.
Unit MHz ns ns ns
--12--
CXD1196AR
5. XTL1 pin, XTL2 pins (1) Self-excited oscillation Item Oscillation frequency Symbol Fmax Min. Typ. 16.9344 Max. Unit MHz
(2) When pulses are to be input to XTL1 pin
Tw Twhx Twlx Vihx Vihx0.9
VDD/2
Vihx0.1 Vilx Tr Tf
Item H level pulse width L level pulse width Pulse interval Input H level Input L level Rise time Fall time
Symbol Twhx Twlx Tw Vihx Vilx Tr Tf
Min. 20 20 VDD-1.0
Typ.
Max.
59 0.8 15 15
Unit ns ns ns V V ns ns
Note) Synchronize XTL1 clock with DSP clock for CD. (Use the clock generated from the same oscillator unit.)
--13--
CXD1196AR
Description of Functions 1. Description of Pins 1.1 CD player interface The CXD1196AR can be directly connected to digital signal processing LSIs for CD of Sony and other company. The digital signal processing LSI for CD is referred to as a DSP for CD. (1) DATA (DATA : Input) Serial data stream from a CIRC LSI (2) BCLK (Bit Clock : Input) Bit clock signal for strobing DATA signal (3) LRCK (LR Clock : Input) LR clock signal indicating Lch and Rch of DATA signal (4) C2PO (C2 Pointer : Input) C2 pointer signal indicating that DATA input contains an error (5) EMP (Emphasis : Input) Emphasis indicating that the data from the DSP is emphasized. (positive logic signal) 1.2 Buffer memory interface The CXD1196AR can be connected to a standard SRAM up to 32 Kbytes (256 Kbits). (1) XMWR (BUFFER MEMORY WRITE : OUT) Data write signal to buffer memory (strobe negative logic output) (2) XMOE (BUFFER MEMORY OUTPUT ENABLE : OUT) Data read signal to buffer memory (strobe negative logic output) (3) MA0-14 (BUFFER MEMORY ADDRESS : OUT) Address signals to buffer memory (4) MDB0-7 (BUFFER MEMORY DATA BUS : BUS) Buffer memory data bus signal pulled up by a typical 25 k resistor In an ADPCM decode playback drive, make sure that the CXD1196AR is connected to a 256 Kbit (8b x 32 Kw, 32 Kbyte) SRAM 1.3 CPU interface (1) XWR (CPU WRITE : Input) Strobe signal for writing to register in chip (negative logic input) (2) XRD (CPU READ : Input) Strobe for reading out status of register chip (negative logic input signal) (3) D0-7 (CPU DATA BUS : Input and output) 8-bit data bus (4) A0 (CPU ADDRESS : Input) CPU address signal for selecting internal register of the CXD1196AR (5) INT (CPU INTERRUPT : Output) Interrupt request output signal for CPU. The polarity of this signal can be controlled by the INTP pin. (6) INTP (INTERRUPT POLARITY : Input) This pin controls the polarity of the INT pin. In the IC, it is pulled up by a typical 50 k register. When INTP= `H' or open, the INT pin goes low active. When INTP= `L' , the INT pin goes high active. (7) XCS (CHIP SELECT : Input) Chip select signal for CPU to select the CXD1196AR (negative logic input)
--14--
CXD1196AR
(8) DRQ (DATA REQUEST : Output) DMA data request signal (positive logic output) (9) XDAC (DATA ACKNOWLEDGE : Input) The acknowledge signal for DRQ (negative logic input). In the IC, it is pulled up by a typical 50 k resistor. 1.4 DAC interface (1) BCKO (BIT CLOCK OUTPUT : Output) Bit clock output signal to DA converter (2) WCKO (WORD CLOCK OUTPUT : Output) Word clock output signal to DA converter (3) LRCO (LR CLOCK OUTPUT : Output) LR clock output signal to DA converter (4) DATO (DATA OUTPUT : Output) Data output signal to DA converter Fig. 1.1 shows a timing chart for interface with the DA converter. 1.5 Miscellaneous (1) MUTE (MUTE : Output) Output H when DA data is muted (2) XRST (RESET : Input) Chip reset signal (negative logic input) (3) XTL1 (X'TAI1 : Input) (4) XTL2 (X'TAI2 : Output) Connect a 16.9344 MHz crystal oscillator unit between XTL1 and XTL2. (The value of the capacitor depends on the crystal oscillator unit.) Or input 16.9344 MHz clock to the XTL1 pin. For ADPCM or CD-DA playback, the clocks of the DSP for CD and this IC must be synchronized. (5) CLK (CLOCK : Output) Output 8.4672 clock. When this clock is not be used, the output of the CLK pin may be fixed at `L'. 1.6 Test pins These pins are normally kept in the opened state. (1) TD0-7 (Input/Output) : Data bus for IC test. Pulled up by a typical 25 k resistor. (2) TDIO (Input) : Input pin for IC test. Pulled up by a typical 50 k resistor. (3) TA0-3 (Input) : Input pins for IC test. Pulled up by a typical 50 k resistor.
--15--
1234
17
32
49
64
BCKO
MSB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 L CH L SB MSB R CH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DATO
16
WCKO
LCKO
Fig. 1.1 Output Format to DA Converter
--16--
CXD1196AR
CXD1196AR
2. Register Functions 2.1 Write register 2.1.1 Register address (REGADR) register This register is used for selection of the internal registers. (1) When A0 = XCS = `L', the REGADR register is selected. When A0 = `H' and XCS = `L', the register specified by the REGADR is selected. (2) When the low order 4 bits of REGADR are not 0 (hex), and a register write or read is made by setting A0 = `H' and XCS = `L', the low order 4 bits of REGADR are incremented. (3) REGADR is cleared by rising edge of DMAEN bit (bit3) of the DMACTL register. (Cleared to 00 (hex).) 2.1.2 DRIVE Interface (DRVIF) register Bit7 XSLOW (/SLOW SPEED) `H' : A DMA cycle is performed in 4 clocks. In this case, a standard SRAM with an access time of less than 120 nsec can be connected to the CXD1196AR. `L' : A DMA cycle is performed in 12 clocks. When the CXD1196R is connected to an SRAM with a slower access time, set this bit at `L'. In this case, a standard SRAM with an access time of less than 320 ns can be connected to the CXD1196AR. For operation at VDD = 3.5 V, set this bit to L. Bit6 C2PL1ST (C2PO Ler-byte 1st) `H' : To input two bytes of DATA input, each with a C2PO identifying the lower or upper byte, in the order of the lower and upper bytes `L' : To input two bytes of DATA input, each with a C2PO identifying the upper or lower byte, in the order of the upper and lower bytes. Here, the upper byte means the 8 (eight) upper bits including the MSB from the DSP for CD. And the lower byte means the 8 (eight) lower bits including the LSB from the DSP for CD. For example, the minute byte of the Header is a lower byte and the sec byte is a upper byte. Bit5 LCHLOW (LCH LOW) `H' : To determine that the data is Lch data when LRCK = `L' `L' : To determine that the data is Lch data when LRCK = `H' BCKRED (BCLK Rising Edge) `H' : To strobe DATA by the rising edge of BCLK `L' : To strobe DATA by the falling edge of BCLK
Bit4
Bit3, 2 BCKMD1, 0 (BCLK Mode 1, 0) Set these bits, depending on the number of BCLK clocks output by the DSP for CD during a cycle of WCLK.
BCKMD1 `L' `L' `H' BCKMD0 `L' `H' `X' 16BCLKs/WCLK 24BCLKs/WCLK 32BCLKs/WCLK
Bit1
LSB 1ST (LSB First) `H' : To connect to a DSP for CD which outputs DATA on an LSB first basis `L' : To connect to a DSP for CD which outputs DATA on an MSB first basis
Bit0
CLKLOW (CLK LOW) `H' : To fix CLK pin output at `L' `L' : To output 8.4672 MHz clock from CLK pin output The values of the individual bits of this register must be changed with the decoder in the disabled state. Table 2.1.1 shows the values of bits of bit 6 through 1 to be set when the CXD1196AR is connected to Sony DSPs for CD. Fig. 2.2.1 (1) through (3) show input timing charts. --17--
CXD1196AR
Sony DSP for CD CDL30 series CDL35 series CDL40 series (48-bit slot mode) CDL40 series (64-bit slot mode)
bit6 L L L
DRVIF register bit5 bit4 bit3 bit2 L L H L H L L L H H H X
bit1 L L H
Timing chart Fig. 2.1.1 (1) Fig. 2.1.1 (2) Fig. 2.1.1 (3)
Table 2.1.1 DRVIF Register Settings (Note 1) CDL30 series CDL35 series CDL40 series CXD1125Q/QZ, CXD1130Q/QZ, CXD1135Q/QZ, CXD1241Q/QZ, CXD1245Q, CXD1246Q/QZ, CXD1247Q/QZ/R, etc. CXD1165Q, CXD1167Q/QZ/R, etc. CXD2500Q/QZ, etc.
2.1.3 Chip Control (CHPCTL) register Bit7-5 RESERVED Bit4 CHPRST (Chip Reset) When this bit is set at `H', the CXD1196AR is internally initialized. The bit setting will automatically change to `L' when the internal initialization of the CXD1196AR is completed. Therefore, there is no need for the CPU to change the setting at `L'. Initialization of the CXD1196AR will be completed in 500ns after the bit has been set at `H' by the CPU. Bit3 CD-DA (CD-Digital Audio) `H' : When a CD-DA disc is to be played back, this bit is set at `H'. The decoder must be placed in the disabled state (DECCTL register) when this bit is set at `H'. `L' : When a CD-ROM disc is to be played back, this bit is set at `L'. Bit2 SWOPN (Sync Window Open) `H' : When this bit is set at `H', the window for detection of SYNC mark will open. In this case, the SYNC protection circuit in the CXD1196AR will be disabled. `L' : When this bit is set at `L', the window for detection of SYNC mark will be controlled by the SYNC protection circuit in the CXD1196AR. Bit1 RPSTART (Repeat Correction Start) When the DECODER is placed in the repeat correction mode, and this bit set at `H', the error correction of the current sector will begin. The bit setting will automatically change to `L' when correction begins. Therefore, there is no need for the CPU to change the setting at `L'. Bit0 ADPEN (ADPCM Enable) When the current sector is an ADPCM sector, the CPU sets this bit at `H' in less than 11.5 ms after a decoder interrupt (DECINT). When the current sector is not an ADPCM sector, the CPU changes the bit setting at `L' in less than 11.5 ms after a decoder interrupt (DECINT).
--18--
CXD1196AR
2.1.4 DECODER CONTROL (DECCTL) Register Bit7 AUTOCI (Auto Coding Information) `H' : To perform ADPCM playback according to the coding information from the drive. In this case, the CI register need not be set. `L' : To perform ADPCM playback according to the value of the CI register. Bit6 RESERVED Should be kept at `L' at all times. Bit5 MODESEL (Mode Select) Bit4 FORMSEL (Form Select) When AUTODIST = `L', the sector is corrected as the following MODE and FORM.
MODESEL `L' `H' `H' FORMSEL `L' `L' `L'
MODE1 MODE2, FORM1 MODE2, FORM2
Bit3
AUTODIST (Auto Distinction) `H' : Errors are corrected according to the MODE byte and FORM bit read from the drive. `L' : Errors are corrected according to bit 5 MODESEL and bit4 FORMSEL. : DECMD 2-0 (Decoder Mode 2-0)
DECMD2 `L' `L' `H' `H' `H' `H' DECMD1 `L' `H' `L' `L' `H' `H' DECMD0 `X' `X' `L' `H' `L' `H'
Bit2-0
Decoder disable Monitor only mode Write only mode Real time correction mode Repeat correction mode Inhibit
These bits are set at `L' when the CDDA bit (bit3) of the CHPCTL register is `H'. 2.1.5 Interrupt Mask (INTMSK) Register When the individual bits of this register are set at `H', an interrupt request from the CXD1196AR to the CPU is enabled in response to the corresponding interrupt status. (That is, when the interrupt status is created, the INT pin is made active.) The value of the individual bits of the register does not affect the corresponding interrupt status. Bit7 ADPEND (ADPCM End) When this chip has completed the ADPCM decode for a sector, if the ADPCM decode for the next sector is not enabled, the ADPEND status is created. DECTOUT (Decoder Time Out) If no SYNC mark is detected during a period of 3 sectors (40.6 ms in normal speed playback mode) after the DECODER has been set in the monitor only, and real time correction modes, the DECTOUT status is created. DMACMP (DMA Complete) When DMA is ended by DMAXFRC, the DMACMP status is created.
Bit6
Bit5
--19--
CXD1196AR
Bit4
DECINT (Decoder Interrupt) If a SYNC mark is detected or internally inserted during execution of the write only, monitor only and real time correction modes by the DECODER, the DECINT status is created. When the SYNC mark detected window is open, however, if the SYNC mark spacing is less than 2352 bytes, the DECINT status is not created. During execution of the repeat correction mode by the DECODER, the DECINT status is created each time a correction ends. Bit3 CIERR (Coding Information Error) When AUTOCI bit of DECCTL register is set at "H" and ADPCM decode playback is done, if there is an error in a CI byte of an ADPCM sector, the CIERR status is created. ADPCM decode playback of this sector will not be done. Bit2-0 RESERVED 2.1.6 Clear Interrupt Status (INCTCLR) Register When the individual bit of this register is set at `H', the corresponding interrupt status is cleared. The individual bit is automatically set at `L' after the interrupt status has been cleared. Therefore, there is no need for the CPU to change the setting at `L'. Bit7 ADPEND (ADPCM End) Bit6 DECTOUT (DECODER Time Out) Bit5 DMACMP (DMA Complete) Bit4 DECINT (DECODER Interrupt) Bit3 CIERR (Coding Information Error) Bit2-0 RESERVED 2.1.7 Coding Information (CI) Register When ADPCM decoding is to be done by setting AUTOCI = `L', the coding information is written to this register. The bit configuration is the same as that of the coding information byte of the sub header. 2.1.8 DMA Address Counter-L (DMAADRC-L)
2.1.9 DMA Address Counter-H (DMAADRC-H) This counter retains the address to be used by the CPU when reading data from the buffer. When the data to be sent to the CPU is read from the buffer, the contents of the DMAADRC are output from MA0-14. Each time data to be sent to the CPU is read from the buffer, the DMAADRC is incremented. The CPU sets the head address of DMA in the DMAADRC before starting DMA. The CPU can read and set the contents of the DMAADRC at any time. Do not change the contents of the DMAADRC during execution of DMA.
--20--
CXD1196AR
2.1.10 DMAXFRC-L 2.1.11 DMA Control (DMACTL) register Bit7 DMAXFRC11 Bit11 (MSB) of DMAXFRC (Transfer Counter) Bit6 DMAXFRC10 bit10 of DMAXFRC Bit5 DMAXFRC9 bit9 of DMAXFRC Bit4 DMAXFRC8 bit8 of DMAXFRC Bit3 DMAEN (CPU DMA Enable) `H' : To enable DMA `L' : To inhibit DMA Bit2-0 RESERVED The DMAXFRC (DMA Transfer Counter) is a counter which indicates the number of DMA transfers. Each time the data to be transferred to the CPU is read from the buffer, the counter is decremented. When the value of the DMAXFRC reaches 0, DMA ends. At this point, interrupt request may be output to the CPU. When data transfer is not to be ended by DMAXFRC as in the case of data transfer in the I/O mode, DMAXFRC should be set at 0 when data transfer is started (when DMAEN bit is set at `H'). The CPU can read and set the contents of DMAXFRC at any time. During execution of DMA, do not change the contents of DMAXFRC. 2.1.12 DRVADRC-L (Drive Address Counter-L) 2.1.13 DRVADRC-H The DRVADRC is a counter which retains the address for writing the data from the drive to the buffer. When the drive data is written to the buffer, the value of DRVADRC is output from MA01-14 pins. Each time a byte of data from the drive is written to the buffer, the DRVADRC is incremented. Before execution of the write only mode and real time correction mode of the DECODER, the CPU sets the buffer write head address in the DRVADRC. The CPU can read and set the contents of DRVADRC at any time. During execution of DMA, do not change the contents of DRVADRC.
--21--
LRCK 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3
24
1
2
3
BCLK L15 L14 L13 L12 L11 L10 Lch MSB Lch for Lower Byte LSB L9 L8 L7 L6 L5 L4 L3 L2 L1 L0
DATA
Ro
Rch LSB
C2PO
for Upper Byte
Fig. 2.1.1 (1) CDL30 and 35 Series Timing Chart
LRCK 4 13 5 6 7 8 9 10 11 12 14 15 16 17 18 19 20 21 22 23 24 1 2 3
24
1
2
3
BCLK L15 L14 L13 L12 L11 L10 L9 L8 L7 Lch MSB for Lower Byte L6 L5 L4 L3 L2 L1 L0 Lch LSB
--22--
5 6 7 8 9
R0 R1 R2 R3 R4 R5 R6 R7
DATA
Ro
Rch LSB
C2PO
for Upper Byte
Fig. 2.1.1 (2) CDL40 Series 48-Bit Slot Mode Timing Chart
LRCK 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3
31 32
1
2
3
4
BCLK
R8 R9 R10 R11 R12 R13 R14 R15
DATA
L14 L15
Lch MSB
Rch LSB for Lower Byte
Rch MSB
C2PO
for Upper Byte
CXD1196AR
Fig. 2.1.1 (3) CDL40 Series 64-Bit Slot Mode Timing Chart
CXD1196AR
2.2 Read register In the descriptions of the registers STS, HDRFLG, HDR, SHDR and CMADR, what is referred to as the current sector refers to the sector where registers are valid for a decoder interrupt (DECINT). In the monitor only and write only modes, the sector from the DSP for CD just before a decoder interrupt is called the current sector. In the real time correction mode and repeat correction mode, the sector that has gone through error detection and correction is referred to as the current sector. 2.2.1 Register Address (REGADR) Register
2.2.2 DMADATA Register When data transfer (buffer read) is to be made in the I/O mode, the CPU reads data from this register. 2.2.3 Interrupt Status (INTSTS) Register The values of the individual bits of this register indicate the respective associated values of interrupt status. These bits are not affected by the values of the individual bits of the INTMSK register. Bit7 ADPEND (ADPCM End) Bit6 DECTOUT (DECODER Time Out) Bit5 DMACMP (DMA Complete) Bit4 DECINT (DECODER Interrupt) Bit3 CIERR (Coding Information Error) 2.2.4 Status (STS) Register Bit7 DRQ (Data Request) This bit indicates the value of the DRQ pin. Bit6 ADPBSY (ADPCM BUSY) This bit goes `H' during ADPCM playback. Bit5 ERINBLK (Erasure in Block) On all the bytes of the current sector except the SYNC byte, this bit goes `H' if there is one or more bytes from the DSP for CD whose C2 pointer is ON. Bit4 CORINH (Correction Inhibit) When the DECCTL register is set AUTODIST bit = `H', this bit goes `H' if the error flag is ON in the MODE (and FORM) byte. Bit3 EDCOK Indicates EDC check showed there were no errors in the current sector. Bit2 ECCOK Indicates there are no more errors from the Header to P parity bytes in the current sector. (In the MODE2, FORM2 sector, this bit is treated as a DON'T CARE bit.) Bit1 SHRTSCT (Short Sector) Indicates the Sync Mark interval was less than 2351 bytes. On this sector, neither ECC nor EDC is executed. Bit0 NOSYNC Indicates that the SYNC Mark, not detected in the predetermined position, is one internally inserted. 2.2.5 Header Flag (HDRFLG) Register Indicates the value of the error pointer of the Header and Sub Header registers.
--23--
CXD1196AR
2.2.6 Header (HDR) Register It is a 4-byte register indicating the Header byte of the current sector. The CPU can find the value of the Header byte of the current sector from the Minute byte as it sets the REGADR register at X4 hex and successively reads data. 2.2.7 Sub Header (SHDR) Register It is a 4-byte register indicating the Sub Header byte of the current sector. The CPU can find the value of the Sub Header byte of the current sector from the File byte as it sets the REGADR register at 08 hex and successively reads data. 2.2.8 Current Minute Address L (CMADR-L) Register
2.2.9 Current Minute Address H (CMADR-H) Register Indicates the buffer memory address where the Minute bytes of the current sector (after correction) is in store. 2.2.10 MODE/FORM (MDFM) Register Bit4-2 RMODE2-0 RMODE2 : Indicates the logic sum of the value of the high-order 6 bits of the raw MODE byte and the pointer. RMODE1, 0 : Respectively indicate the values of the low-order 2 bits of the raw MODE byte. Bit1 CMODE (Correction Mode) Bit0 CFORM (Correction Form) These bits indicate which of the MODEs and FORMs this IC determined that the current sector was associated with when it corrected errors.
CFORM `X' `L' `H' CMODE `L' `H' `H'
MODE1 MODE2, FORM1 MODE2, FORM2
2.2.11 ADPCI (ADPCM Coding Information) Register Bit7 MUTE This bit goes `H' when the DA data is muted on. Bit6 EMPHASIS This bit goes `H' when the ADPCM data is emphasized. Bit5 EOR (End of Record) This bit goes `H' when the Sub Mode byte bit0 = `H' and there is no error in the Sub Mode byte. Bit4 BITLNGTH (Bit Length) This bit indicates the bit length of ADPCM playback coding information. `H' : 8 bits `L' : 4 bits Bit2 FS (Sampling Frequency) This bit indicates the ADPCM playback sampling frequency. `H' : 18.9 kHz `L' : 37.8 kHz Bit0 M/S (MONO/STEREO) This bit indicates "monaural" or "stereo" of ADPCM playback coding information. `H' : Stereo `L' : Monaural
--24--
CXD1196AR
2.2.12 DMAXFRC-L 2.2.13 DMAXFRC-H 2.2.14 DMAADRC-H 2.2.15 DMAADRC-H 2.2.16 DRVADRC-L 2.2.17 DRVADRC-H
REG REGADR RESERVED DRVIF CHPCTL DECCTL INTMSK INTCLR CI DMA ADRC-L DMA ADRC-H DMA XFRC-L DMACTL DRV ADRC-L DRV ADRC-H TEST2 TEST1 TEST0
A0 L H H H H H H H H H H H H H H H H
RA X X0 X1 X2 X3 X4 X5 X6 X7 X8 X9 XA XB XC 1D 1E 1F
bit7 L L XSLOW L AUTO CI ADP END ADP END L bit7 L bit7 xfrc11 bit7 L L L L L L
bit6 L L
bit5
bit4 RA4 L BCK RED CHP RST FORM SEL DEC INT DEC INT BIT L4H8 bit4 bit12 bit4 xfrc8 bit4 bit12 L L L
bit3 RA3 L BCK MD1 CDDA AUTO DIST CI ERR CI ERR L bit3 bit11 bit3 DMA EN bit3 bit11 L L L
bit2 RA2 L BCK MD0 SW OPEN DEC MD2 L L FS L3H1 bit2 bit10 bit2 L bit2 bit10 L L L
bit1 RA1 L LSB 1st RPS TART DEC MD1 L L L bit1 bit9 bit1 L bit1 bit9 L L L
bit0 RA0 L CLKL ADP EN DEC MD0 L L MONO STE bit0 bit8 bit0 L bit0 bit8 L L L
C2PO L1st L L DEC TOUT DEC TOUT EMPH ASIS bit6 bit14 bit6 xfrc10 bit6 bit14 L L L
LCH LOW CLR ADP MODE SEL DMA CMP DMA CMP L bit5 bit13 bit5 xfrc9 bit5 bit13 L L L
Write Registers
--25--
CXD1196AR
REG REGADR DMA DATA INTSTS STS HDRFLG HDR MIN HDR SEC HDR BLOCK HDR MODE SHDR FILE SHDR CH SHDR S-MODE SHDR CI CMADR L CMADR H MDFM ADPCI DMA XFRC-L DMA XFRC-H DMA ADRC-L DMA ADRC-H DRV ADRC-L DRV ADRC-H TEST 0 to 2
A0 L H H H H H H H H H H H H H H H H H H H H H H H
RA X 00 01 02 03 X4 X5 X6 X7 08 09 0A 0B 0C 0D XE XF 18 19 1A 1B 1C 1D 10 to 2
bit7 X bit7 ADP END DRQ MIN bit7 bit7 bit7 bit7 bit7 bit7 bit7 bit7 bit7 X X MUTE bit7 X bit7 X bit7 X X X
bit6 X
bit5
bit4 RA4 bit4 DEC INT COR INH MODE bit4 bit4 bit4 bit4 bit4 bit4 bit4 bit4 bit4 bit12 RAW MD2 BIT L4H8 bit4 bit12 bit4 bit12 bit4 bit12 X
bit3 RA3 bit3 CI ERR EDC OK FILE bit3 bit3 bit3 bit3 bit3 bit3 bit3 bit3 bit3 bit11 RAW MD1 X bit3 bit11 bit3 bit11 bit3 bit11 X
bit2 RA2 bit2 X ECC OK CHAN NEL bit2 bit2 bit2 bit2 bit2 bit2 bit2 bit2 bit2 bit10 RAW MD0 FS L3H1 bit2 bit10 bit2 bit10 bit2 bit10 X
bit1 RA1 bit1 X SHRT SCT SUB MODE bit1 bit1 bit1 bit1 bit1 bit1 bit1 bit1 bit1 bit9 C MODE X bit1 bit9 bit1 bit9 bit1 bit9 X
bit0 RA0 bit0 X NO SYNC CI bit0 bit0 bit0 bit0 bit0 bit0 bit0 bit0 bit0 bit8 C FORM MONO STE bit0 bit8 bit0 bit8 bit0 bit8 X
bit6 DEC TOUT ADP BSY SEC bit6 bit6 bit6 bit6 bit6 bit6 bit6 bit6 bit6 bit14 X EMPH ASIS bit6 bit14 bit6 bit14 bit6 bit14 X
bit5 DMA CMP ERIN BLK BLO CK bit5 bit5 bit5 bit5 bit5 bit5 bit5 bit5 bit5 bit13 X EOR bit5 bit13 bit5 bit13 bit5 bit13 X
Read Registers
--26--
CXD1196AR
32K Byte SRAM
CXD2500
3 XMOE
4 XMWR
5-11 MAO-MA6
13-20 MA7-MA14
24-31 MDBO-MDB7
D/A CONVERTER
LRCK 32 DA16 34 DA15 35 C2PO 44 PSSL EMPH 61
38 LRCK 37 DATA 36 BCLK 34 C2PO 35 EMP 44 INTP
WCKO 45 LRCO 46 DATO 47
CXD1196AR
BCKO 48 MUTE 50
30
XRST 59 XWR XRD XCS INT AO CXD2500 : 48-bit slot mode DRVIF register : LLHLHL Note) CXD2500 is in 64-bit slot mode; CXD2500 CXD1196A DA12 38 DA14 36 DA13 37 38 LRCK 37 DATA 36 BCLK D4-D0 74-78 D7-D5 69-71
64
65
66
67
68
CPU VDD, GND pins excluded.
DRVIF register : LHLHXH
CXD1196AR Connection Diagram
--27--
CXD1196AR
Package Outline
Unit : mm
80PIN LQFP (PLASTIC)
14.0 0.2 60 61 12.0 0.1 41 40
A
80 1 + 0.08 0.18 - 0.03 20
21 (0.22)
0.5
0.13 M
+ 0.2 1.5 - 0.1
+ 0.05 0.127 - 0.02 0.1
0.1 0.1
0 to 10
0.5 0.2
NOTE: Dimension "" does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE LQFP-80P-L01 LQFP080-P-1212 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42 ALLOY 0.5g
--28--
0.5 0.2
(13.0)


▲Up To Search▲   

 
Price & Availability of CXD1196

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X